Invention Grant
- Patent Title: High-density substrate processing systems and methods
-
Application No.: US16922874Application Date: 2020-07-07
-
Publication No.: US11574826B2Publication Date: 2023-02-07
- Inventor: Jason M. Schaller , Steve Hongkham , Charles T. Carlson , Tuan A. Nguyen , Swaminathan T. Srinivasan , Khokan Chandra Paul
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.
Public/Granted literature
- US20210013055A1 HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS Public/Granted day:2021-01-14
Information query
IPC分类: