- 专利标题: Soldering apparatus, computer-readable medium, and soldering method
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申请号: US16205942申请日: 2018-11-30
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公开(公告)号: US11577334B2公开(公告)日: 2023-02-14
- 发明人: Yoshitomo Teraoka , Satoshi Manda , Tomoo Takahara
- 申请人: Hakko Corporation
- 申请人地址: JP Osaka
- 专利权人: Hakko Corporation
- 当前专利权人: Hakko Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Squire Patton Boggs (US) LLP
- 优先权: JPJP2017-230236 20171130
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; B23K3/08 ; B23K3/06 ; B23K3/02 ; G05B19/18 ; G06F30/39 ; B23K31/02
摘要:
Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.
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