公开(公告)号：US11273510B2

公开(公告)日：2022-03-15

申请号：US16143011

申请日：2018-09-26

申请人： Hakko Corporation

发明人： Yoshitomo Teraoka ,  Tomoo Takahara

IPC分类号： B23K3/00 ,  B23K3/08 ,  B23K3/02 ,  G05B19/00

摘要： The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.

公开(公告)号：US11577334B2

公开(公告)日：2023-02-14

申请号：US16205942

申请日：2018-11-30

申请人： Hakko Corporation

发明人： Yoshitomo Teraoka ,  Satoshi Manda ,  Tomoo Takahara

IPC分类号： H05K3/34 ,  B23K3/08 ,  B23K3/06 ,  B23K3/02 ,  G05B19/18 ,  G06F30/39 ,  B23K31/02

摘要： Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.