Invention Grant
- Patent Title: Chip of thermoelectric conversion material
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Application No.: US17282047Application Date: 2019-10-02
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Publication No.: US11581471B2Publication Date: 2023-02-14
- Inventor: Tsuyoshi Muto , Kunihisa Kato , Taku Nemoto , Wataru Morita , Yuta Seki
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Itabashi-ku
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Itabashi-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2018-190442 20181005
- International Application: PCT/JP2019/038914 WO 20191002
- International Announcement: WO2020/071424 WO 20200409
- Main IPC: H01L35/34
- IPC: H01L35/34 ; H01L35/32
Abstract:
A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.
Public/Granted literature
- US20210391523A1 CHIP OF THERMOELECTRIC CONVERSION MATERIAL Public/Granted day:2021-12-16
Information query
IPC分类:
