Invention Grant
- Patent Title: Component mounting system
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Application No.: US16484450Application Date: 2018-01-31
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Publication No.: US11587804B2Publication Date: 2023-02-21
- Inventor: Akira Yamauchi
- Applicant: BONDTECH CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: BONDTECH CO., LTD.
- Current Assignee: BONDTECH CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Aslan Law, P.C.
- Priority: JPJP2017-021953 20170209,WOPCT/JP2017/040651 20171110,WOPCT/JP2018/001467 20180118
- International Application: PCT/JP2018/003308 WO 20180131
- International Announcement: WO2018/147147 WO 20180816
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B29C35/08 ; B29C45/14 ; H01L21/02 ; H01L21/56 ; H01L21/677 ; H01L21/68 ; H01L21/683 ; H01L21/66 ; H01L23/544 ; H01L23/00 ; H05K13/04 ; B29L31/34

Abstract:
A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.
Public/Granted literature
Information query
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