Invention Grant
- Patent Title: Copper foil having excellent adhesive strength, electrode comprising same, secondary battery comprising same, and manufacturing method therefor
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Application No.: US16489021Application Date: 2018-02-26
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Publication No.: US11588156B2Publication Date: 2023-02-21
- Inventor: Seung Min Kim
- Applicant: KCF Technologies Co., Ltd.
- Applicant Address: KR Anyang-si
- Assignee: KCF Technologies Co., Ltd.
- Current Assignee: KCF Technologies Co., Ltd.
- Current Assignee Address: KR Anyang-si
- Agency: K&L Gates LLP
- Priority: KR10-2017-0025581 20170227
- International Application: PCT/KR2018/002311 WO 20180226
- International Announcement: WO2018/155972 WO 20180830
- Main IPC: H01M4/00
- IPC: H01M4/00 ; H01M4/66 ; C25D1/04 ; H05K1/09 ; H05K3/02 ; H01M50/534 ; H01M4/02
Abstract:
An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below. MBF=(maximum Young's modulus−minimum Young's modulus)/(average Young's modulus) [Formula 1]
Public/Granted literature
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