公开(公告)号：US11949110B2

公开(公告)日：2024-04-02

申请号：US16643773

申请日：2018-08-27

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  An Na Lee

IPC: H01M4/66 ,  C25D1/04 ,  C25D3/38 ,  C25D5/48 ,  H01M4/04 ,  H01M10/0525

CPC classification number: H01M4/661 ,  C25D1/04 ,  C25D3/38 ,  C25D5/48 ,  H01M4/0438 ,  H01M10/0525

Abstract: The present invention relates to a copper foil current collector having superior adhesion to an active material of a Li secondary battery. The electrolytic copper foil of the present invention having a first surface and a second surface comprises: a first protective layer at the first surface; a second protective layer at the second surface; and a copper film between the first and second protective layers, wherein an oxygen-containing part at the second surface has a thickness (OT) of not less than 1.5 nm. According to the present invention, an electrolytic copper foil current collector for a Li secondary battery, which has low electric resistance and high adhesion to an active material, can be provided.

公开(公告)号：US11346015B2

公开(公告)日：2022-05-31

申请号：US16959360

申请日：2019-01-25

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  Joong Kyu An ,  Shan Hua Jin

IPC: C25D7/06 ,  C25D1/04 ,  C25D3/38 ,  H01M4/66 ,  H01M10/052

Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.

公开(公告)号：US10787752B2

公开(公告)日：2020-09-29

申请号：US16126470

申请日：2018-09-10

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  Jeong Gil Lee

IPC: C25D3/38 ,  C25D5/48 ,  C25D5/16 ,  H05K1/03 ,  H05K3/42 ,  C25D7/06 ,  H05K3/02 ,  H05K3/28 ,  C25D1/04

Abstract: Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 μm and a texture coefficient bias [TCB(220)] of 0.52 or less.

公开(公告)号：US11505873B2

公开(公告)日：2022-11-22

申请号：US16631739

申请日：2018-07-25

Applicant: KCF Technologies Co., Ltd.

Inventor： Shan Hua Jin ,  An Na Lee ,  Seung Min Kim

IPC: C25D7/04 ,  C25D1/04 ,  C25D3/38 ,  C25D5/34 ,  C25D5/48 ,  H01M4/13 ,  H01M4/66 ,  H01M10/052 ,  B32B15/01

Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.

公开(公告)号：US11355757B2

公开(公告)日：2022-06-07

申请号：US17083824

申请日：2020-10-29

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim

IPC: C25D7/06 ,  C25D3/02 ,  C25D5/00 ,  C25D1/04 ,  C25D3/38 ,  H01M4/66 ,  H01M4/13 ,  H01M10/0525 ,  H01M4/02

Abstract: Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.

公开(公告)号：US11588156B2

公开(公告)日：2023-02-21

申请号：US16489021

申请日：2018-02-26

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim

IPC: H01M4/00 ,  H01M4/66 ,  C25D1/04 ,  H05K1/09 ,  H05K3/02 ,  H01M50/534 ,  H01M4/02

Abstract: An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below. MBF=(maximum Young's modulus−minimum Young's modulus)/(average Young's modulus)  [Formula 1]

公开(公告)号：US11352707B2

公开(公告)日：2022-06-07

申请号：US15999169

申请日：2018-08-17

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  An Na Lee ,  Ho Gun Kim ,  Shan Hua Jin

IPC: C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  H01M4/66 ,  C25D7/06 ,  C25D3/58 ,  C25D5/00 ,  H05K1/03 ,  H05K3/02 ,  H01M10/0525

Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra  [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.

公开(公告)号：US11346014B2

公开(公告)日：2022-05-31

申请号：US16643758

申请日：2018-08-24

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  Ho Gun Kim

IPC: H01M4/02 ,  C25D1/04 ,  C25D3/38 ,  C25D5/48 ,  H01M4/66 ,  H01M4/70

Abstract: The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/μm+ peak density/30+ amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.