Invention Grant
- Patent Title: Method for forming a structure with a hole
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Application No.: US16995281Application Date: 2020-08-17
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Publication No.: US11594450B2Publication Date: 2023-02-28
- Inventor: Dieter Pierreux , Steven van Aerde , Bert Jongbloed
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L27/11556 ; H01L27/11582 ; G11C5/06 ; H01L23/538 ; G11C5/02

Abstract:
A method for forming a structure with a hole on a substrate is disclosed. The method may comprise: depositing a first structure on the substrate; etching a first part of the hole in the first structure; depositing a plug fill in the first part of the hole; depositing a second structure on top of the first structure; etching a second part of the hole substantially aligned with the first part of the hole in the second structure; and, etching the plug fill of the first part of the hole and thereby opening up the hole by dry etching. In this way 3-D NAND device may be provided.
Public/Granted literature
- US20210057275A1 METHOD FOR FORMING A STRUCTURE WITH A HOLE Public/Granted day:2021-02-25
Information query
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