Invention Grant
- Patent Title: Physical vapor deposition system and processes
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Application No.: US17552513Application Date: 2021-12-16
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Publication No.: US11599016B2Publication Date: 2023-03-07
- Inventor: Vibhu Jindal , Wen Xiao , Sanjay Bhat
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: G03F1/24
- IPC: G03F1/24
Abstract:
A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets. A process for improving reflectivity from a multilayer stack is also disclosed.
Public/Granted literature
- US20220107558A1 PHYSICAL VAPOR DEPOSITION SYSTEM AND PROCESSES Public/Granted day:2022-04-07
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