Invention Grant
- Patent Title: Surface topography measurement apparatus and method
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Application No.: US17747639Application Date: 2022-05-18
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Publication No.: US11604151B2Publication Date: 2023-03-14
- Inventor: Weimin Li , Wen Xiao , Vibhu Jindal , Sanjay Bhat
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: G01N21/956
- IPC: G01N21/956 ; G03F7/20 ; G03F1/24

Abstract:
Apparatus and methods for measuring surface topography are described. The analysis apparatus and methods detect light reflected from the reflective backside of a cantilever assembly including a tip, calculate a background level (BGL) value obtained from an optical scan of a reference sample using a power spectral density (PSD) value obtained from a topographical scan of a reference sample to generate a correlational coefficient between the BGL and the PSD values. The correlational coefficient between the BGL and PSD values is used to measure the BGL value of additional EUV mask blanks by a topographical scan of the EUV mask blanks using the same tip mounted to the cantilever.
Public/Granted literature
- US20220283100A1 Surface Topography Measurement Apparatus And Method Public/Granted day:2022-09-08
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