In some examples, a method comprises: obtaining a substrate having at a metal interconnect layer deposited over the substrate; forming a first dielectric layer on the metal interconnect layer; forming a second dielectric layer on the first dielectric layer; forming a capacitor metal layer on the second dielectric layer; patterning and etching the capacitor metal layer and the second dielectric layer to the first dielectric layer to leave a portion of the capacitor metal layer and the second dielectric layer on the first dielectric layer; forming an anti-reflective coating to cover the portion of the capacitor metal layer and the second dielectric layer, and to cover the metal interconnect layer; and patterning the metal interconnect layer to form a first metal layer and a second metal layer.