Invention Grant
- Patent Title: Materials and layout design options for DSA on transition regions over active die
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Application No.: US16457699Application Date: 2019-06-28
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Publication No.: US11605623B2Publication Date: 2023-03-14
- Inventor: Gurpreet Singh , Eungnak Han , Paul A. Nyhus , Florian Gstrein , Richard E. Schenker
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L27/02
- IPC: H01L27/02 ; C08L33/12 ; C08L25/06 ; C08L53/00

Abstract:
An integrated circuit structure includes an active region containing more active semiconductor devices, wherein the active region comprises a first grating of metal and dielectric materials with only vertically aligned structures thereon. A transition region containing inactive structures is adjacent to the active region, wherein the transition region comprises a second grating of metal and dielectric materials having at least one of vertical aligned structures and vertical random structures thereon. Both the active regions and the transition regions have an absence of non-uniform gratings with horizontal parallel polymer sheets thereon.
Information query
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