Invention Grant
- Patent Title: Silicon carbide semiconductor device with a contact region having edges recessed from edges of the well region
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Application No.: US17542303Application Date: 2021-12-03
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Publication No.: US11615953B2Publication Date: 2023-03-28
- Inventor: Amaury Gendron-Hansen , Bruce Odekirk
- Applicant: Microchip Technology Inc.
- Applicant Address: US AZ Chandler
- Assignee: Microchip Technology Inc.
- Current Assignee: Microchip Technology Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Glass & Associates
- Agent Kenneth Glass; Kenneth D'Alessandro
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/04 ; H01L27/092 ; H01L21/67

Abstract:
A silicon carbide semiconductor device includes a silicon carbide (SiC) substrate having a SiC epitaxial layer disposed over a surface of the SiC substrate, the SiC substrate having a first conductivity and the SiC epitaxial layer having the first conductivity. A contact region and a well region are formed in the SiC epitaxial layer, the contact region and the well region have a doping level of a second conductivity opposite the first conductivity. The contact region lies completely within the well region, is not in contact with a region having the first conductivity and has edges recessed from edges of the well region.
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