Invention Grant
- Patent Title: Substrate processing apparatus and processing liquid concentration method
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Application No.: US16712405Application Date: 2019-12-12
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Publication No.: US11615971B2Publication Date: 2023-03-28
- Inventor: Teruaki Konishi , Kouzou Kanagawa , Osamu Kuroda , Koji Tanaka , Kotaro Tsurusaki , Hidemasa Aratake , Kouji Ogura , Keita Hirase
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2018-232113 20181212
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/311
Abstract:
There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.
Information query
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