- 专利标题: Semiconductor devices having buried gates
-
申请号: US17318563申请日: 2021-05-12
-
公开(公告)号: US11626409B2公开(公告)日: 2023-04-11
- 发明人: Huijung Kim , Minwoo Kwon , Sangyeon Han , Sangwon Kim , Junsoo Kim , Hyeonjin Shin , Eunkyu Lee
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: F. Chau & Associates, LLC
- 优先权: KR10-2020-0114405 20200908
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L29/423 ; H01L29/78
摘要:
A semiconductor device includes a substrate including an active region, a gate structure disposed in a gate trench in the substrate, a bit line disposed on the substrate and electrically connected to the active region on one side of the gate structure, and a capacitor disposed on the bit line and electrically connected to the active region on another side of the gate structure. The gate structure includes a gate dielectric layer disposed on bottom and inner side surfaces of the gate trench, a conductive layer disposed on the gate dielectric layer in a lower portion of the gate trench, sidewall insulating layers disposed on the gate dielectric layer, on an upper surface of the conductive layer, a graphene conductive layer disposed on the conductive layer, and a buried insulating layer disposed between the sidewall insulating layers on the graphene conductive layer.
公开/授权文献
- US20220077154A1 SEMICONDUCTOR DEVICES HAVING BURIED GATES 公开/授权日:2022-03-10
信息查询
IPC分类: