Invention Grant
- Patent Title: Semiconductor devices having buried gates
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Application No.: US17318563Application Date: 2021-05-12
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Publication No.: US11626409B2Publication Date: 2023-04-11
- Inventor: Huijung Kim , Minwoo Kwon , Sangyeon Han , Sangwon Kim , Junsoo Kim , Hyeonjin Shin , Eunkyu Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2020-0114405 20200908
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/423 ; H01L29/78

Abstract:
A semiconductor device includes a substrate including an active region, a gate structure disposed in a gate trench in the substrate, a bit line disposed on the substrate and electrically connected to the active region on one side of the gate structure, and a capacitor disposed on the bit line and electrically connected to the active region on another side of the gate structure. The gate structure includes a gate dielectric layer disposed on bottom and inner side surfaces of the gate trench, a conductive layer disposed on the gate dielectric layer in a lower portion of the gate trench, sidewall insulating layers disposed on the gate dielectric layer, on an upper surface of the conductive layer, a graphene conductive layer disposed on the conductive layer, and a buried insulating layer disposed between the sidewall insulating layers on the graphene conductive layer.
Public/Granted literature
- US20220077154A1 SEMICONDUCTOR DEVICES HAVING BURIED GATES Public/Granted day:2022-03-10
Information query
IPC分类: