Invention Grant
- Patent Title: Air spacer formation with a spin-on dielectric material
-
Application No.: US17192134Application Date: 2021-03-04
-
Publication No.: US11626482B2Publication Date: 2023-04-11
- Inventor: Ting-Ting Chen , Chen-Han Wang , Keng-Chu Lin , Shuen-Shin Liang , Tsu-Hsiu Perng , Tsai-Jung Ho , Tsung-Han Ko , Tetsuji Ueno , Yahru Cheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/8234 ; H01L29/66 ; H01L21/768 ; H01L29/49

Abstract:
The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.
Public/Granted literature
- US20220285492A1 AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL Public/Granted day:2022-09-08
Information query
IPC分类: