Invention Grant
- Patent Title: Thickness sensor for conductive features
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Application No.: US17143032Application Date: 2021-01-06
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Publication No.: US11631618B2Publication Date: 2023-04-18
- Inventor: Chih Hung Chen , Kei-Wei Chen , Ying-Lang Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/321 ; B24B37/013 ; G01B7/06

Abstract:
Various embodiments provide a thickness sensor and method for measuring a thickness of discrete conductive features, such as conductive lines and plugs. In one embodiment, the thickness sensor generates an Eddy current in a plurality of discrete conductive features, and measures the generated Eddy current generated in the discrete conductive features. The thickness sensor has a small sensor spot size, and amplifies peaks and valleys of the measured Eddy current. The thickness sensor determines a thickness of the discrete conductive features based on a difference between a minimum amplitude value and a maximum amplitude value of the measured Eddy current.
Public/Granted literature
- US20210125881A1 THICKNESS SENSOR FOR CONDUCTIVE FEATURES Public/Granted day:2021-04-29
Information query
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