Invention Grant
- Patent Title: Structure and formation method of semiconductor device with stressor
-
Application No.: US16834440Application Date: 2020-03-30
-
Publication No.: US11631770B2Publication Date: 2023-04-18
- Inventor: Shi-Ning Ju , Kuo-Cheng Chiang , Guan-Lin Chen , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/3105 ; H01L21/3115 ; H01L21/8234

Abstract:
A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes multiple semiconductor nanostructures over a substrate and two epitaxial structures over the substrate. Each of the semiconductor nanostructures is between the epitaxial structures, and the epitaxial structures are p-type doped. The semiconductor device structure also includes a gate stack wrapping around the semiconductor nanostructures. The semiconductor device structure further includes a dielectric stressor structure between the gate stack and the substrate. The epitaxial structures extend exceeding a top surface of the dielectric stressor structure.
Public/Granted literature
- US20210135011A1 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH STRESSOR Public/Granted day:2021-05-06
Information query
IPC分类: