Invention Grant
- Patent Title: Temperature-control during crimping of an implant
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Application No.: US16760147Application Date: 2018-10-21
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Publication No.: US11633277B2Publication Date: 2023-04-25
- Inventor: Maxim Karalnik , Or Cohen , Michael Albitov , Oren Shua , Meni Iamberger , Ilia Hariton
- Applicant: CARDIOVALVE LTD.
- Applicant Address: IL Or Yehuda
- Assignee: CARDIOVALVE LTD.
- Current Assignee: CARDIOVALVE LTD.
- Current Assignee Address: IL Or Yehuda
- Agency: Dilworth IP, LLC
- Priority: GB1800399 20180110
- International Application: PCT/IL2018/051122 WO 20181021
- International Announcement: WO2019/138400 WO 20190718
- Main IPC: A61F2/95
- IPC: A61F2/95 ; B21D39/04 ; A61F2/24

Abstract:
An assembly (10) for crimping a frame (56) of an implant (58) comprises a crimping device (20) with a base (22) and a crimping mechanism (24) that defines a crimping aperture (26). A bath (28) having a floor (30), and one or more side-walls (32) extending upward from the floor to a side-wall height defines a receptacle (18) that is shaped to receive a portion of the crimping device. The apparatus has an assembled state in which the portion of the crimping device has been received by the receptacle, the crimping device is held securely by the bath, and the aperture is below the side-wall height. Other embodiments are also described.
Information query
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