- 专利标题: Package and method of forming same
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申请号: US16884843申请日: 2020-05-27
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公开(公告)号: US11635566B2公开(公告)日: 2023-04-25
- 发明人: Chih-Hsuan Tai , Chung-Ming Weng , Hung-Yi Kuo , Cheng-Chieh Hsieh , Hao-Yi Tsai , Chung-Shi Liu , Chen-Hua Yu
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; G02B6/42 ; H01L23/498 ; G02B6/13 ; G02B6/43
摘要:
An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.
公开/授权文献
- US20210157052A1 PACKAGE AND METHOD OF FORMING SAME 公开/授权日:2021-05-27