Invention Grant
- Patent Title: Display device and method of manufacturing semiconductor device
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Application No.: US17159154Application Date: 2021-01-27
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Publication No.: US11640088B2Publication Date: 2023-05-02
- Inventor: Ryo Onodera , Hajime Watakabe , Akihiro Hanada
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2020-013402 20200130
- Main IPC: G02F1/1362
- IPC: G02F1/1362 ; G02F1/1335 ; G02F1/1368

Abstract:
A high definition display device is provided. The display device includes an array substrate, and an opposing substrate. The array substrate has a substrate, and on the substrate, a first pixel having a first color filter and a second pixel having a second color filter disposed adjacent to the first pixel. Each of the first color filter and the second color filter has a first dielectric layer, a transmissive layer disposed on the first dielectric layer, and a second dielectric layer disposed on the transmissive layer. The transmissive layer of the first color filter has a first film thickness, and the transmissive layer of the second color filter has a second film thickness larger than the first film thickness. On the transmissive layer of the second color filter, a first layer different from the transmissive layer is disposed on a side of the transmissive layer of the first color filter. A height of a bottom face of the first layer is equal to the first film thickness.
Public/Granted literature
- US20210240042A1 DISPLAY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-08-05
Information query
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