Invention Grant
- Patent Title: Image sensor and manufacturing method thereof
-
Application No.: US17137300Application Date: 2020-12-29
-
Publication No.: US11641000B2Publication Date: 2023-05-02
- Inventor: Zhaoyao Zhan , Qianwei Ding , Xiaohong Jiang , Ching Hwa Tey
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN202011318904.0 20201123
- Main IPC: H01L31/032
- IPC: H01L31/032 ; H01L27/146 ; H01L31/028 ; H01L31/0352

Abstract:
The invention provides an image sensor, the image sensor includes a substrate, a first circuit layer located on the substrate, and at least one nanowire photodiode located on the first circuit layer and electrically connected to the first circuit layer, the nanowire photodiode comprises a lower material layer and an upper material layer with a P-N junction between the lower material layer and the upper material layer, the lower material layer includes perovskite material.
Public/Granted literature
- US20220165895A1 Image sensor and manufacturing method thereof Public/Granted day:2022-05-26
Information query
IPC分类: