Invention Grant
- Patent Title: Electronic apparatus
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Application No.: US17040731Application Date: 2019-03-29
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Publication No.: US11644249B2Publication Date: 2023-05-09
- Inventor: Mahiro Hachiya , Minoru Yoshikawa
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 2018071069 2018.04.02
- International Application: PCT/JP2019/013972 2019.03.29
- International Announcement: WO2019/194089A 2019.10.10
- Date entered country: 2020-09-23
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H05K7/20 ; F28D15/04 ; G06F1/20

Abstract:
This electronic apparatus 100 comprises a heating element 20, and a case 30. The case 30 has an opening hole 31. In order that a refrigerant COO will be sealed between the case 30 and the heating element 20, the outer periphery part of a first heating element external surface 21, which is the external surface of the heating element 20, is attached to the outer periphery part of the opening hole 31. Also, the refrigerant COO is a refrigerant that is capable of phase change from a liquid refrigerant LP-COO to a gas phase refrigerant GP-COO. As a result, it is possible to more efficiently cool the heat of the heating element 20.
Public/Granted literature
- US20210010757A1 ELECTRONIC APPARATUS Public/Granted day:2021-01-14
Information query
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