Invention Grant
- Patent Title: Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring
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Application No.: US17013279Application Date: 2020-09-04
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Publication No.: US11646302B2Publication Date: 2023-05-09
- Inventor: Wei Chen , Jie-Hua Zhao , Jun Zhai , Po-Hao Chang , Hsien-Che Lin , Ying-Chieh Ke , Kunzhong Hu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/24
Abstract:
Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
Public/Granted literature
- US20210305227A1 Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring Public/Granted day:2021-09-30
Information query
IPC分类:
