公开(公告)号：US11646302B2

公开(公告)日：2023-05-09

申请号：US17013279

申请日：2020-09-04

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Po-Hao Chang ,  Hsien-Che Lin ,  Ying-Chieh Ke ,  Kunzhong Hu

IPC: H01L25/18 ,  H01L23/24

CPC classification number: H01L25/18 ,  H01L23/24

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：US12249599B2

公开(公告)日：2025-03-11

申请号：US18194236

申请日：2023-03-31

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Po-Hao Chang ,  Hsien-Che Lin ,  Ying-Chieh Ke ,  Kunzhong Hu

IPC: H01L25/18 ,  H01L23/24

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：US20210305227A1

公开(公告)日：2021-09-30

申请号：US17013279

申请日：2020-09-04

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Po-Hao Chang ,  Hsien-Che Lin ,  Ying-Chieh Ke ,  Kunzhong Hu

IPC: H01L25/18 ,  H01L23/24

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：US20230317708A1

公开(公告)日：2023-10-05

申请号：US18194236

申请日：2023-03-31

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Po-Hao Chang ,  Hsien-Che Lin ,  Ying-Chieh Ke ,  Kunzhong Hu

IPC: H01L25/18 ,  H01L23/24

CPC classification number: H01L25/18 ,  H01L23/24

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.