Invention Grant
- Patent Title: Uplink transport protocol acknowledgment shaping and downlink data shaping at a user equipment
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Application No.: US16991901Application Date: 2020-08-12
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Publication No.: US11646852B2Publication Date: 2023-05-09
- Inventor: Priyangshu Ghosh , Arnaud Meylan , Vaibhav Kumar , Sitaramanjaneyulu Kanamarlapudi , Alok Mitra , Vamsi Krishna Dokku , Ravi Balasubramanian , Mohammed Ali , Rushil Gholap , Narender Mannem
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson + Sheridan, LLP
- Main IPC: H04L5/00
- IPC: H04L5/00 ; H04W72/0446 ; H04W28/02

Abstract:
Certain aspects of the present disclosure provide techniques for uplink transport protocol acknowledgment shaping and downlink data shaping at a user equipment. A method that may be performed by the UE generally includes determining an allowed number of transport protocol acknowledgments to transmit in a transmission time interval (TTI); and transmitting one or more transport protocol acknowledgments in the TTI based, at least in part, on the determined allowed number of transport protocol acknowledgments. Another method that may be performed by the UE generally includes determining an allowed number of downlink data units to transmit in a TTI; and transmitting one or more data units in the TTI based, at least in part, on the determined allowed number of data units.
Public/Granted literature
- US20210050984A1 UPLINK TRANSPORT PROTOCOL ACKNOWLEDGMENT SHAPING AND DOWNLINK DATA SHAPING AT A USER EQUIPMENT Public/Granted day:2021-02-18
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