公开(公告)号：US11646852B2

公开(公告)日：2023-05-09

申请号：US16991901

申请日：2020-08-12

Applicant: QUALCOMM Incorporated

Inventor： Priyangshu Ghosh ,  Arnaud Meylan ,  Vaibhav Kumar ,  Sitaramanjaneyulu Kanamarlapudi ,  Alok Mitra ,  Vamsi Krishna Dokku ,  Ravi Balasubramanian ,  Mohammed Ali ,  Rushil Gholap ,  Narender Mannem

IPC: H04L5/00 ,  H04W72/0446 ,  H04W28/02

CPC classification number: H04L5/0082 ,  H04L5/0055 ,  H04W28/0278 ,  H04W72/0446

Abstract: Certain aspects of the present disclosure provide techniques for uplink transport protocol acknowledgment shaping and downlink data shaping at a user equipment. A method that may be performed by the UE generally includes determining an allowed number of transport protocol acknowledgments to transmit in a transmission time interval (TTI); and transmitting one or more transport protocol acknowledgments in the TTI based, at least in part, on the determined allowed number of transport protocol acknowledgments. Another method that may be performed by the UE generally includes determining an allowed number of downlink data units to transmit in a TTI; and transmitting one or more data units in the TTI based, at least in part, on the determined allowed number of data units.