Invention Grant
- Patent Title: Thermal compression bonder nozzle with vacuum relief features
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Application No.: US17332830Application Date: 2021-05-27
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Publication No.: US11652080B2Publication Date: 2023-05-16
- Inventor: Mihir Oka , Kartik Srinivasan , Wei Tan , James Mellody
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: B23K37/00
- IPC: B23K37/00 ; H01L23/00 ; B23K3/00 ; B23K37/04

Abstract:
An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.
Public/Granted literature
- US20210288021A1 THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES Public/Granted day:2021-09-16
Information query
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