公开(公告)号：US12176318B2

公开(公告)日：2024-12-24

申请号：US18130338

申请日：2023-04-03

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: B23K3/00 ,  B23K37/00 ,  B23K37/04 ,  H01L23/00

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

公开(公告)号：US20210288021A1

公开(公告)日：2021-09-16

申请号：US17332830

申请日：2021-05-27

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: H01L23/00

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

公开(公告)号：US20230238352A1

公开(公告)日：2023-07-27

申请号：US18130338

申请日：2023-04-03

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: H01L23/00 ,  B23K37/04 ,  B23K3/00

CPC classification number: H01L24/75 ,  B23K3/00 ,  B23K37/04 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75984

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

公开(公告)号：US11652080B2

公开(公告)日：2023-05-16

申请号：US17332830

申请日：2021-05-27

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: B23K37/00 ,  H01L23/00 ,  B23K3/00 ,  B23K37/04

CPC classification number: H01L24/75 ,  B23K3/00 ,  B23K37/04 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75984

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.