公开(公告)号：US11652080B2

公开(公告)日：2023-05-16

申请号：US17332830

申请日：2021-05-27

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: B23K37/00 ,  H01L23/00 ,  B23K3/00 ,  B23K37/04

CPC classification number: H01L24/75 ,  B23K3/00 ,  B23K37/04 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75984

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

公开(公告)号：US09283641B2

公开(公告)日：2016-03-15

申请号：US13626869

申请日：2012-09-25

Applicant: INTEL CORPORATION

Inventor： Rajen S. Sidhu ,  Martha A. Dudek ,  Wei Tan

IPC: B23K35/36 ,  B23K35/02 ,  H01L21/48 ,  B23K35/362 ,  H01L23/498

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/3612 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/16225

Abstract: Embodiments of the present disclosure are directed towards flux materials for heated solder placement and associated techniques and configurations. In one embodiment, a method includes depositing a flux material on one or more pads of a package substrate, the flux material including a rosin material and a thixotropic agent and depositing one or more solder balls on the flux material disposed on the one or more pads, wherein depositing the one or more solder balls on the flux material is performed at a temperature greater than 80° C., and wherein the rosin material and the thixotropic agent are configured to resist softening at the temperature greater than 80° C. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于加热的焊料放置和相关联的技术和构造的助焊剂材料。 在一个实施例中，一种方法包括在封装基板的一个或多个焊盘上沉积焊剂材料，焊剂材料包括松香材料和触变剂，并且将一个或多个焊球沉积在设置在一个或多个焊盘上的焊剂材料上 其中将所述一个或多个焊球沉积在所述焊剂材料上在大于80℃的温度下进行，并且其中所述松香材料和所述触变剂构造成在大于80℃的温度下抵抗软化。其它实施方案 可以被描述和/或要求保护。

公开(公告)号：US12176318B2

公开(公告)日：2024-12-24

申请号：US18130338

申请日：2023-04-03

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: B23K3/00 ,  B23K37/00 ,  B23K37/04 ,  H01L23/00

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

公开(公告)号：US20210288021A1

公开(公告)日：2021-09-16

申请号：US17332830

申请日：2021-05-27

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: H01L23/00

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

公开(公告)号：US20230238352A1

公开(公告)日：2023-07-27

申请号：US18130338

申请日：2023-04-03

Applicant: Intel Corporation

Inventor： Mihir Oka ,  Kartik Srinivasan ,  Wei Tan ,  James Mellody

IPC: H01L23/00 ,  B23K37/04 ,  B23K3/00

CPC classification number: H01L24/75 ,  B23K3/00 ,  B23K37/04 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75984

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

公开(公告)号：US09960105B2

公开(公告)日：2018-05-01

申请号：US13631939

申请日：2012-09-29

Applicant: INTEL CORPORATION

Inventor： Hongin Jiang ,  Arun Kumar C. Nallani ,  Wei Tan

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/48 ,  H01L23/49816 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed.

公开(公告)号：US20170066088A1

公开(公告)日：2017-03-09

申请号：US14846489

申请日：2015-09-04

Applicant: Intel Corporation

Inventor： Mohit Sood ,  Boxi Liu ,  Wei Tan ,  Huili Xu ,  Kabir J. Mirpuri

IPC: B23K35/26 ,  B23K35/02 ,  H01L23/00 ,  H05K3/36 ,  H01L21/48 ,  H05K1/18 ,  H05K1/14 ,  H05K3/34 ,  B23K1/00 ,  H01L23/498

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/1339 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16502 ,  H01L2224/16505 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01323 ,  H01L2924/01324 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately 0.6 micrometers from one another. Other embodiments may be described and/or claimed.

Abstract translation: 本文的实施例可以涉及具有球栅阵列（BGA）封装的装置，其包括多个非共晶材料的焊球。 在实施例中，多个焊球的相应焊球可以在BGA的衬底和第二衬底之间形成焊接接头。 在一些实施例中，接头可以彼此小于约0.6微米。 可以描述和/或要求保护其他实施例。