Invention Grant
- Patent Title: Solar cell module including solar cells
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Application No.: US16725927Application Date: 2019-12-23
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Publication No.: US11652178B2Publication Date: 2023-05-16
- Inventor: Haruhisa Hashimoto , Kenichi Maki
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC HOLDINGS CORPORATION
- Current Assignee: PANASONIC HOLDINGS CORPORATION
- Current Assignee Address: JP Osaka
- Agency: McDermott Will and Emery LLP
- Priority: JP 2018245939 2018.12.27
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L31/02 ; H01L31/048 ; H01L31/05 ; H01L33/50 ; H01L33/62 ; H01L33/64 ; H01L23/488 ; H01L23/00
Abstract:
The finger electrode is formed by hard-soldered silver paste. The melting point of the first type solder layer provided on the surface of the terminal wiring member is higher than the melting point of the second type solder layer provided on the surface of the wire. The first width, in the first direction, of the second type solder layer in the first portion where the wire is connected to the terminal wiring member is larger than the second width, in the first direction, of the second type solder layer in the second portion where the wire is connected to the finger electrode.
Public/Granted literature
- US20200212233A1 SOLAR CELL MODULE INCLUDING SOLAR CELLS Public/Granted day:2020-07-02
Information query
IPC分类:
