Invention Grant
- Patent Title: Flexible substrates with chemical and moisture resistance
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Application No.: US16864927Application Date: 2020-05-01
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Publication No.: US11654667B2Publication Date: 2023-05-23
- Inventor: Gary M. Skwarek , Carl Altman , Jong Lee , Eric Rainal , Awdhoot Vasant Kerkar , Alagappan Thenappan
- Applicant: HONEYWELL INTERNATIONAL INC.
- Applicant Address: US NJ Morris Plains
- Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee Address: US NC Charlotte
- Agency: Lorenz & Kopf, LLP
- Main IPC: C08J5/18
- IPC: C08J5/18 ; B32B27/32 ; B32B27/36 ; B32B27/34 ; B65D75/30 ; B32B37/15 ; B29C48/00 ; B29C48/18 ; A61M35/00 ; B32B27/08 ; A61K9/70 ; B29L31/00 ; B29K27/00

Abstract:
Flexible packages, transdermal drug delivery devices, and methods for fabricating packages are provided. An exemplary flexible package includes a chemical and moisture resistant layer formed from poly(chlorotrifluoroethylene-co-vinylidene fluoride) (“P(CTFE-co-VDF)”) copolymer. Further, the exemplary flexible package includes a substance to be delivered. The substance is applied to or enclosed by the chemical and moisture resistant layer.
Public/Granted literature
- US1690090A Spreader Public/Granted day:1928-10-30
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