Invention Grant
- Patent Title: System, apparatus and method for dynamic thermal distribution of a system on chip
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Application No.: US16217312Application Date: 2018-12-12
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Publication No.: US11656676B2Publication Date: 2023-05-23
- Inventor: Rolf Kuehnis , Matthew Long , Julien Sebot
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/3296 ; G01K7/02 ; H03K17/082
Abstract:
In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.
Information query
