Invention Grant
- Patent Title: Signal bridging using an unpopulated processor interconnect
-
Application No.: US17115384Application Date: 2020-12-08
-
Publication No.: US11657014B2Publication Date: 2023-05-23
- Inventor: Jason R. Talbert
- Applicant: ADVANCED MICRO DEVICES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/20 ; G06F9/4401

Abstract:
Signal bridging using an unpopulated processor interconnect, including: communicatively coupling an apparatus to a plurality of first signal paths between a bootstrap processor (BSP) and a processor interconnect of a circuit board; communicatively coupling the apparatus to a plurality of second signal paths between the processor interconnect and a peripheral interface of the circuit board; and communicatively coupling the BSP to the peripheral interface via one or more third signal paths in the apparatus.
Public/Granted literature
- US20220179817A1 SIGNAL BRIDGING USING AN UNPOPULATED PROCESSOR INTERCONNECT Public/Granted day:2022-06-09
Information query