Invention Grant
- Patent Title: Magnetic random access memory and manufacturing method thereof
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Application No.: US17316406Application Date: 2021-05-10
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Publication No.: US11659718B2Publication Date: 2023-05-23
- Inventor: Ji-Feng Ying , Duen-Huei Hou
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/22
- IPC: H01L27/22 ; G11C11/16 ; H01L43/12 ; H01L43/08 ; H01L43/02 ; H01L43/10 ; B82Y25/00

Abstract:
A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
Public/Granted literature
- US20210265424A1 MAGNETIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-08-26
Information query
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