Invention Grant
- Patent Title: Built-in self-test for die-to-die physical interfaces
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Application No.: US17320165Application Date: 2021-05-13
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Publication No.: US11662380B2Publication Date: 2023-05-30
- Inventor: Fabien S. Faure , Arnaud J. Forestier , Vikram Mehta
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Agent Scott W. Pape; Dean M. Munyon
- Main IPC: G01R31/3177
- IPC: G01R31/3177 ; G01R31/317 ; G01R31/3185 ; G01R31/319 ; G01R31/28 ; G01R31/66

Abstract:
A system includes a first integrated circuit including a first interface circuit with a first transmit pin and a first receive pin, and a first test circuit. The system also includes a second integrated circuit including a second interface circuit with a second receive pin coupled to the first transmit pin, and a second transmit pin coupled to the first receive pin. The second integrated circuit further includes a second test circuit configured to route signals from the second receive pin to the second transmit pin, such that the sent test signal is received by the second receive pin, bypasses the second test circuit, and is routed to the second transmit pin. The first test circuit is further configured to receive the routed test signal on the first receive pin via the second conductive path.
Public/Granted literature
- US20220365135A1 Built-in Self-Test for Die-to-Die Physical Interfaces Public/Granted day:2022-11-17
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