An integrated circuit product includes a redistribution layer, an integrated circuit die disposed above the redistribution layer, a row of discrete devices disposed laterally with respect to the integrated circuit die, and encapsulant mechanically coupling the redistribution layer, integrated circuit die, and the row of discrete devices. In at least one embodiment, the row of discrete devices is a row of decoupling capacitors disposed proximate to the integrated circuit die and coupled to the integrated circuit die and a power distribution network. In at least one embodiment, a second integrated circuit die is disposed above the redistribution layer and disposed laterally with respect to the integrated circuit die and the row of discrete devices. The second integrated circuit die is mechanically coupled to the redistribution layer, integrated circuit die, and the row of discrete devices and is partially surrounded by the row of discrete devices.