Invention Grant
- Patent Title: High voltage CMOS with co-planar upper gate surfaces for embedded non-volatile memory
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Application No.: US17184953Application Date: 2021-02-25
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Publication No.: US11672124B2Publication Date: 2023-06-06
- Inventor: Harry-Hak-Lay Chuang , Wei Cheng Wu , Ya-Chen Kao , Yi Hsien Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- The original application number of the division: US14324369 2014.07.07
- Main IPC: H10B43/40
- IPC: H10B43/40 ; H01L29/66 ; H01L29/423 ; H01L29/51 ; H01L27/11573 ; H01L21/8234 ; H01L27/092 ; H01L27/088

Abstract:
The present disclosure relates to an integrated circuit that includes a semiconductor substrate having a periphery region and memory cell region separated by a boundary region. A pair of split gate flash memory cells are disposed on the memory cell region and include a first select gate and a first memory gate. A first gate electrode is disposed over a first gate dielectric layer on the periphery region. A second gate electrode is disposed over a second gate dielectric layer on the periphery region at a position between the boundary region and the first gate electrode. The second dielectric layer is thicker than the first gate dielectric layer. The first select gate and the first memory gate have upper surfaces that are co-planar or level with the upper surface of the second gate electrode.
Public/Granted literature
- US20210183880A1 HIGH VOLTAGE CMOS WITH CO-PLANAR UPPER GATE SURFACES FOR EMBEDDED NON-VOLATILE MEMORY Public/Granted day:2021-06-17
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