Invention Grant
- Patent Title: Film forming method and film forming apparatus
-
Application No.: US16852478Application Date: 2020-04-19
-
Publication No.: US11674224B2Publication Date: 2023-06-13
- Inventor: Yasuaki Kikuchi , Tatsuya Yamaguchi , Kazuteru Obara , Ryuji Kusajima
- Applicant: Tokyo electron limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 2019086435 2019.04.26
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/458 ; C23C16/34

Abstract:
A film forming method includes: accommodating a substrate in a processing container of a film forming apparatus; supplying an inert gas to the processing container at a flow rate equal to an average flow rate of a plurality of gases to be supplied into the processing container in a film forming process and maintaining a pressure of the processing container to be substantially same as an average pressure of the processing container in the film forming process; and alternately supplying the plurality of gases into the processing container and forming a film on the substrate.
Public/Granted literature
- US20200340111A1 FILM FORMING METHOD AND FILM FORMING APPARATUS Public/Granted day:2020-10-29
Information query
IPC分类: