- 专利标题: Multiple independent on-chip interconnect
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申请号: US17337805申请日: 2021-06-03
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公开(公告)号: US11675722B2公开(公告)日: 2023-06-13
- 发明人: Sergio Kolor , Sergio V. Tota , Tzach Zemer , Sagi Lahav , Jonathan M. Redshaw , Per H. Hammarlund , Eran Tamari , James Vash , Gaurav Garg , Lior Zimet , Harshavardhan Kaushikkar , Steven Fishwick , Steven R. Hutsell , Shawn M. Fukami
- 申请人: Apple Inc.
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 代理机构: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- 主分类号: G06F13/40
- IPC分类号: G06F13/40 ; G06F15/173
摘要:
In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.
公开/授权文献
- US20220334997A1 Multiple Independent On-chip Interconnect 公开/授权日:2022-10-20
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