Invention Grant
- Patent Title: Electronic package with multiple electronic components spaced apart by grooves
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Application No.: US17747900Application Date: 2022-05-18
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Publication No.: US11676877B2Publication Date: 2023-06-13
- Inventor: Hong-Da Chang , Chun-Chang Ting , Chi-Jen Chen
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, LLP
- Priority: TW 8132528 2019.09.10
- The original application number of the division: US16734612 2020.01.06
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56
Abstract:
A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.
Public/Granted literature
- US20220278013A1 Electronic package with multiple electronic components spaced apart by grooves Public/Granted day:2022-09-01
Information query
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