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公开(公告)号：US11676877B2
公开(公告)日：2023-06-13
申请号：US17747900
申请日：2022-05-18
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Hong-Da Chang , Chun-Chang Ting , Chi-Jen Chen
CPC classification number: H01L23/3178 , H01L21/563
Abstract: A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.
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公开(公告)号：US20220278013A1
公开(公告)日：2022-09-01
申请号：US17747900
申请日：2022-05-18
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Hong-Da Chang , Chun-Chang Ting , Chi-Jen Chen
Abstract: A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.
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公开(公告)号：US20210074603A1
公开(公告)日：2021-03-11
申请号：US16734612
申请日：2020-01-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Hong-Da Chang , Chun-Chang Ting , Chi-Jen Chen
Abstract: A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.
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