公开(公告)号：US12107055B2

公开(公告)日：2024-10-01

申请号：US18109120

申请日：2023-02-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsun Hsu ,  Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Rui-Feng Tai ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3157 ,  H01L24/05 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/16 ,  H01L2224/05556 ,  H01L2224/16227

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

公开(公告)号：US11676877B2

公开(公告)日：2023-06-13

申请号：US17747900

申请日：2022-05-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hong-Da Chang ,  Chun-Chang Ting ,  Chi-Jen Chen

IPC: H01L23/31 ,  H01L21/56

CPC classification number: H01L23/3178 ,  H01L21/563

Abstract: A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.

公开(公告)号：US11532528B2

公开(公告)日：2022-12-20

申请号：US17160720

申请日：2021-01-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.

公开(公告)号：US20220278013A1

公开(公告)日：2022-09-01

申请号：US17747900

申请日：2022-05-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hong-Da Chang ,  Chun-Chang Ting ,  Chi-Jen Chen

IPC: H01L23/31 ,  H01L21/56

Abstract: A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.

公开(公告)号：US20210074603A1

公开(公告)日：2021-03-11

申请号：US16734612

申请日：2020-01-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hong-Da Chang ,  Chun-Chang Ting ,  Chi-Jen Chen

IPC: H01L23/31 ,  H01L21/56

Abstract: A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.

公开(公告)号：US12205906B2

公开(公告)日：2025-01-21

申请号：US18537638

申请日：2023-12-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Yuan-Hung Hsu ,  Chi-Jen Chen

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/538

Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.

公开(公告)号：US20230187382A1

公开(公告)日：2023-06-15

申请号：US18109120

申请日：2023-02-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsun Hsu ,  Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Rui-Feng Tai ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L25/0655 ,  H01L23/3157 ,  H01L25/50 ,  H01L21/4853 ,  H01L24/05 ,  H01L21/56 ,  H01L2224/05556 ,  H01L24/16 ,  H01L2224/16227

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

公开(公告)号：US20220181225A1

公开(公告)日：2022-06-09

申请号：US17160720

申请日：2021-01-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.

公开(公告)号：US20220173052A1

公开(公告)日：2022-06-02

申请号：US17160749

申请日：2021-01-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsun Hsu ,  Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Rui-Feng Tai ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

公开(公告)号：US20240162169A1

公开(公告)日：2024-05-16

申请号：US18537638

申请日：2023-12-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Yuan-Hung Hsu ,  Chi-Jen Chen

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/76804 ,  H01L23/5384 ,  H01L23/5386

Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.