Invention Grant
- Patent Title: Semiconductor laser module
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Application No.: US16985277Application Date: 2020-08-05
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Publication No.: US11677210B2Publication Date: 2023-06-13
- Inventor: Yusuke Inaba , Maiko Ariga , Kazuki Yamaoka
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 2018024398 2018.02.14
- Main IPC: H01S5/02251
- IPC: H01S5/02251 ; H01S5/02253 ; H01S5/02326

Abstract:
A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.
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