Invention Grant
- Patent Title: Methods of forming a staircase structure
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Application No.: US17173405Application Date: 2021-02-11
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Publication No.: US11678481B2Publication Date: 2023-06-13
- Inventor: Rohit Kothari , Jason C. McFarland , Jason Reece , David A. Kewley , Adam L. Olson
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L27/11556 ; H01L21/3213 ; H01L27/11582 ; G03F7/00
Abstract:
Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
Public/Granted literature
- US20210167079A1 METHODS OF FORMING A STAIRCASE STRUCTURE Public/Granted day:2021-06-03
Information query
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