Invention Grant
- Patent Title: Package substrates with magnetic build-up layers
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Application No.: US17360701Application Date: 2021-06-28
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Publication No.: US11682613B2Publication Date: 2023-06-20
- Inventor: Zhiguo Qian , Kaladhar Radhakrishnan , Kemal Aygun
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/64 ; H01L23/498 ; H01L21/68 ; H01L21/48 ; H01L23/00 ; H01L23/538

Abstract:
The present disclosure is directed to systems and methods for improving the impedance matching of semiconductor package substrates by incorporating one or more magnetic build-up layers proximate relatively large diameter, relatively high capacitance, conductive pads formed on the lower surface of the semiconductor package substrate. The one or more magnetic layers may be formed using a magnetic build-up material deposited on the lower surface of the semiconductor package substrate. Vias conductively coupling the conductive pads to bump pads on the upper surface of the semiconductor package substrate pass through and are at least partially surrounded by the magnetic build-up material.
Public/Granted literature
- US20210327795A1 PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS Public/Granted day:2021-10-21
Information query
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