- Patent Title: Transistor gate structure with hybrid stacks of dielectric material
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Application No.: US16209039Application Date: 2018-12-04
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Publication No.: US11688788B2Publication Date: 2023-06-27
- Inventor: Johann C. Rode , Samuel J. Beach , Nidhi Nidhi , Rahul Ramaswamy , Han Wui Then , Walid Hafez
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/51 ; H01L29/06 ; H01L29/423 ; H01L29/49 ; H01L29/786 ; H01L29/66 ; H01L29/78 ; H01L21/28

Abstract:
An integrated circuit includes a gate structure in contact with a portion of semiconductor material between a source region and a drain region. The gate structure includes gate dielectric and a gate electrode. The gate dielectric includes at least two hybrid stacks of dielectric material. Each hybrid stack includes a layer of low-κ dielectric and a layer of high-κ dielectric on the layer of low-κ dielectric, where the layer of high-κ dielectric has a thickness at least two times the thickness of the layer of low-κ dielectric. In some cases, the layer of low-κ dielectric has a thickness no greater than 1.5 nm. The layer of high-κ dielectric may be a composite layer that includes two or more layers of compositionally-distinct materials. The gate structure can be used with any number of transistor configurations but is particularly useful with respect to group III-V transistors.
Public/Granted literature
- US20200176582A1 TRANSISTOR GATE STRUCTURE WITH HYBRID STACKS OF DIELECTRIC MATERIAL Public/Granted day:2020-06-04
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