Invention Grant
- Patent Title: Method for epitaxial growth and device
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Application No.: US17651839Application Date: 2022-02-21
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Publication No.: US11688794B2Publication Date: 2023-06-27
- Inventor: Tzu-Hsiang Hsu , Ting-Yeh Chen , Wei-Yang Lee , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16682305 2019.11.13
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/092 ; H01L29/06 ; H01L29/08 ; H01L29/165 ; H01L29/78 ; H01L21/02 ; H01L21/3065 ; H01L21/764 ; H01L21/8238 ; H10B10/00

Abstract:
A semiconductor device includes first and second semiconductor fins extending from a substrate and a source/drain region epitaxially grown in recesses of the first and second semiconductor fins. A top surface of the source/drain region is higher than a surface level with top surfaces of the first and second semiconductor fins. The source/drain region includes a plurality of buffer layers. Respective layers of the plurality of buffer layers are embedded between respective layers of the source/drain region.
Public/Granted literature
- US20220181469A1 METHOD FOR EPITAXIAL GROWTH AND DEVICE Public/Granted day:2022-06-09
Information query
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