Invention Grant
- Patent Title: Impregnation device and shaping apparatus
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Application No.: US16923333Application Date: 2020-07-08
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Publication No.: US11697253B2Publication Date: 2023-07-11
- Inventor: Wataru Suzuki , Daisuke Nakayama , Taichi Yamada , Nobuhiro Katsuta
- Applicant: FUJIFILM BUSINESS INNOVATION CORP.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 20028649 2020.02.21
- Main IPC: B29C70/50
- IPC: B29C70/50 ; B29C64/118 ; B29C70/16 ; B29C64/393 ; B33Y30/00

Abstract:
An impregnation device includes an impregnation unit, a first supply unit, a second supply unit, and a supply controller. The impregnation unit impregnates a bundle of transported continuous fibers with a resin mixture. The first supply unit supplies a resin of a first composition to the impregnation unit. The second supply unit supplies a resin of a second composition that is different from the resin of the first composition to the impregnation unit. The supply controller controls an amount of resin supplied from the first supply unit and the second supply unit to the impregnation unit.
Public/Granted literature
- US20210260838A1 IMPREGNATION DEVICE AND SHAPING APPARATUS Public/Granted day:2021-08-26
Information query
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